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ASML (NASDAQ:ASML) will ship its latest chipmaking system to Taiwan Semiconductor Manufacturing (TSM) and Samsung Electronics (OTCPK:SSNLF) this year, Bloomberg News reported.
The Netherlands-based company’s shares were up about 4% premarket on Wednesday.
All three of ASML’s largest customers, TSM, Samsung and Intel (INTC) will get the High Numerical Aperture Extreme Ultraviolet lithography, or High NA EUV, system by the end of 2024, the report added citing ASML CFO Roger Dassen, who spoke to analysts in a recent call, as per a company spokesperson.
In April, Intel said it has assembled the industry’s first High NA EUV system developed by ASML (ASML), following decades of collaboration with the Dutch company, at its Oregon facility.
It was not known when TSM, the largest EUV customer of ASML, would get the equipment, according to the report.
ASML’s new machine can imprint semiconductors with lines which are 8 nanometers thick — 1.7-times smaller than that of the prior generation — and will be used for making chips which will power artificial intelligence, or AI, applications and advanced consumer electronics, the report noted.
Each system costs €350M (about $380M) and weigh around two Airbus A320s.
TSM had voiced concerns about the price of the system. “I like the high-NA EUV’s capability, but I don’t like the sticker price,” Kevin Zhang, TSM’s senior vice president, had said in Amsterdam in May.
The Taiwan-based company’s A16 node technology, which is due in late 2026, would not require the use of ASML’s High-NA EUV machines and can continue to work on TSM’s older extreme ultraviolet equipment, Zhang had said.
ASML continues to see 2025 revenue to be likely in the upper half of the guidance range, the analysts noted after the call with Dassen.
Analysts at Jefferies, noted that ASML’s average orders could be around €5.7B in the remaining three quarters of 2024, pushing 2025 sales to €40B, the report added.